JPH0142344Y2 - - Google Patents

Info

Publication number
JPH0142344Y2
JPH0142344Y2 JP1983186277U JP18627783U JPH0142344Y2 JP H0142344 Y2 JPH0142344 Y2 JP H0142344Y2 JP 1983186277 U JP1983186277 U JP 1983186277U JP 18627783 U JP18627783 U JP 18627783U JP H0142344 Y2 JPH0142344 Y2 JP H0142344Y2
Authority
JP
Japan
Prior art keywords
board
metal substrate
substrate
metal
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983186277U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6092832U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1983186277U priority Critical patent/JPS6092832U/ja
Publication of JPS6092832U publication Critical patent/JPS6092832U/ja
Application granted granted Critical
Publication of JPH0142344Y2 publication Critical patent/JPH0142344Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
JP1983186277U 1983-11-30 1983-11-30 混成集積回路装置 Granted JPS6092832U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983186277U JPS6092832U (ja) 1983-11-30 1983-11-30 混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983186277U JPS6092832U (ja) 1983-11-30 1983-11-30 混成集積回路装置

Publications (2)

Publication Number Publication Date
JPS6092832U JPS6092832U (ja) 1985-06-25
JPH0142344Y2 true JPH0142344Y2 (en]) 1989-12-12

Family

ID=30402394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983186277U Granted JPS6092832U (ja) 1983-11-30 1983-11-30 混成集積回路装置

Country Status (1)

Country Link
JP (1) JPS6092832U (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2810285B2 (ja) * 1993-01-20 1998-10-15 株式会社日立製作所 半導体装置及びその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5245056A (en) * 1976-09-27 1977-04-08 Gen Corp Integrated circuit and method of producing same
JPS58122763A (ja) * 1982-01-14 1983-07-21 Toshiba Corp 樹脂封止型半導体装置

Also Published As

Publication number Publication date
JPS6092832U (ja) 1985-06-25

Similar Documents

Publication Publication Date Title
JPH064595Y2 (ja) ハイブリッドｉｃ
JPH0142344Y2 (en])
KR100246312B1 (ko) 반도체 패키지의 제조방법
JP2925722B2 (ja) ハーメチックシール型電気回路装置
JPH023621Y2 (en])
KR900002354Y1 (ko) 혼성 집적회로 장치
JPH06140535A (ja) テープキャリアパッケージ型半導体装置
JPS63175454A (ja) 半導体モジュール
JPH023622Y2 (en])
JPS6398678U (en])
JPH0375539U (en])
JPS5923432Y2 (ja) 半導体装置
JP2599290Y2 (ja) ハイブリッドｉｃ
JPH0710972U (ja) 回路基板
JPH04245467A (ja) 混成集積機能回路装置
JPH03283649A (ja) 半導体装置用パッケージ
JP2000307027A (ja) 半導体装置とそれに用いるリードフレーム
JPH04164362A (ja) Ｐｌｃｃ型混成集積回路装置
JPS59143336A (ja) Ｉｃチツプのパツケ−ジ方法
JPS6079771U (ja) 多層配線基板
JPS6149453U (en])
JPH02106062A (ja) 半導体装置
JPH01163334U (en])
KR19980066592A (ko) 비엘피(blp) 및 그의 제조 방법
JPS6387889U (en])